SolidRun's Bedrock RAI300: First Fanless Edge PC with AMD Ryzen AI 9 HX 370

SolidRun has announced the first industrial PC based on the AMD Ryzen AI 9 HX 370 with support for the latest AMD ROCm 7 stack. The combination of high-performance Zen 5 cores, Radeon iGPU, XDNA NPU and high memory capacity in a compact and ruggedized x86 device provides secure and robust edge AI processing capabilities. AMD Ryzen AI 9 HX 370 processor contains a 12C/24T Zen 5 CPU (up to 5.1 GHz), Radeon 890M GPU with 16 graphics cores and a 50 TOPS NPU. Up to 128 GB of DDR5 capacity allows for the local execution of large AI models. Bedrock RAI300 is designed in the field-proven Bedrock form factor, exhibiting remarkable passive cooling capability which allows operation at full industrial temperature range of -40°C to 85°C. Bedrock RAI300 fits seamlessly into the modular ecosystem of the Bedrock family and can be configured using the same Networking & I/O boards (NIO), Storage & Extension boards (SX) and Power Modules (PM). "Bedrock RAI300 brings performance enhancement across the board - in processing, graphics and AI." said Irad Stavi, IPC Product Line Manager at SolidRun. "Existing Bedrock customers can upgrade seamlessly to Bedrock RAI300 at the same form factor and power envelope with full backward compatibility. For Edge AI applications, ROCm 7 is now supported in a ruggedized fanless and field-proven system with high performance, high capacity of memory and storage and rich and versatile I/O". Bedrock RAI300 Features CPU power in Bedrock RAI300 can be precisely adjusted in BIOS in an extremely wide range between 8 W - 54 W. RAM and storage are modular with 2x SODIMMs supporting 128 GB DDR5 5600, and 3 NVMe 2280 PCIE Gen4x4 devices, including enterprise-grade NVMe with power loss protection (PLP). RAM and storage are conduction-cooled for reliable operation at extreme temperatures. Multiple I/O configurations are available including up to 4 displays comprising HDMI 2.1 + 3x DP 2.1, up to 4 2.5 Gbit Ethernet ports (Intel I226), optional LTE modem, USB4 type-C, 4 USB 3.2 ports and a console port. All I/O is conveniently organized on a single face to simplify integration. Bedrock RAI300 supports all major PC operating systems, including most Linux distributions, Windows Desktop, Server and IoT. The Bedrock RAI300, consistent with the entire Bedrock series, offers customers greater logistical flexibility in the current challenging market for RAM and storage by being available for order as a barebone unit.Power, Mechanical and Thermal Design Bedrock RAI300 electronic design is modular, SoM based. Power input is by an optional Power Module (PM) for supporting various deployment use cases. Three PM options are currently available 12 V - 24 V, 12 V - 48 V and 12 V - 60 V. The enclosure is made of heavy-duty machined aluminium with an anodized finish. It is offered in 2 variants - 1.6 liter for 60 W and an 0.6 liter "Tile" variant for conduction cooling. The enclosure is ideal for DIN-Rail mounting with a specially designed zero-force locking bracket. Bedrock RAI300 fanless design can handle up to 60 W, which is over 3 times the cooling capacity of typical fanless PCs of similar size. Cooling innovations include liquid metal TIM, 360º stacked heat pipes, dual-layer chimney effect heat exchanger and thermal coupling of all internal devices. The system operates reliably at a temperature range of -40°C to 85°C. Source: SolidRun Related News 1 Comment on SolidRun Launches Bedrock RAI300 Fanless Edge PC with AMD Ryzen AI 9 HX 370 #1 zenlessyank Not sure about the Bedrock form factor, but I do like red and 12 cores. This has nice potential and has USB4 ;) Would make a nice router/VM host that you can hide away. Posted on Jan 19th 2026, 8:31 Reply