Samsung's HPB Tech Adopted by Other Smartphone Chip Manufacturers

Just before Christmas, Samsung fully unveiled its brand-new Exynos 2600 application processor (AP). The firm's Semiconductor division started teasing this next-gen smartphone chip around late 2025, with pre-launch details being shared via teaser trailers and sparsely populated splash pages. During the winter holiday period, the South Korean giant's foundry business detailed its pioneering "Heat Path Block" (HPB) technology. This intriguing aspect of the Exynos 2600 SoC's design was leaked mid-way through December; when industry moles started whispering about HPB tech being shopped to Apple and Qualcomm. Samsung's FoWLP_HPB (Fan-out Wafer Level Package with Heat Path Block) technology could address the problems faced by rival chip designers—in particular, it is believed that Qualcomm's next-wave Snapdragon 8 Elite mobile SoCs would require more potent heat dissipation solutions. According to fresh inside track information—courtesy of the "Fixed-focus Digital Cameras" Weibo blog—HPB tech is now adopted by "many chip manufacturers that commonly use Android chips." The leaker believes that stronger heat dissipation will lead to greater overclocking capabilities on (non-Samsung) next-gen mobile chips. According to official descriptions, the development of FoWLP_HPB has improved the thermal resistance: "of the (Exynos 2600) AP die by reducing the size of the DRAM that obstructs the heat dissipation path and attaching Heat Path Block to facilitate heat release. Additionally, High-k EMC is applied to ensure that heat is efficiently transferred toward the HPB direction...With these packaging innovations, Samsung's mobile packaging technology enables efficient outward heat dissipation, resulting in up to a 16% reduction in thermal resistance compared to previous packages and delivering enhanced performance." Current-gen flagship smartphone chips can operate at impressive frequencies, but thermal considerations have set certain limits. The now "old school" placement of a wider DRAM layer—that restricts heat being drawn away from the CPU die—could be considered a major obstacle, going forward. Samsung: "Liberate the limits of dimensions. HPB, Heat Path Block. Opening a new era of thermal solutions. Now on Exynos 2600. Learn more about the technology behind this video." Sources: Fixed-focus Digital Cameras (Weibo blog), Wccftech Related News